7.06 Semiconductor & Magnetic Memory Core Operations

In-depth analysis of semiconductor memory cell electronics (6T SRAM latches, 1T1C DRAM refresh dynamics, Flash floating gates) and magnetic core coincident-current selection (X-Y matrix, destructive read-out, restore cycle).

1. Semiconductor Memory Hierarchy & Comparison Matrix

Memory TypeCell StructureVolatilityRefresh NeededRelative SpeedDensity
SRAMCross-coupled 6T MOSFET latchVolatileNoExtremely Fast (1-10 ns)Low
DRAM1T MOSFET + 1 Storage Capacitor (1T1C)VolatileYes (2-64 ms)Fast (30-60 ns)High
EPROMFloating-Gate MOSFET (UV erased)Non-VolatileNoFast Read / Slow WriteMedium
EEPROMFloating-Gate MOSFET (Electrically erased)Non-VolatileNoFast Read / Slow WriteMedium
FlashBlock-erasable Floating-Gate arrayNon-VolatileNoFast Read / Block WriteHigh

2. Magnetic Core Memory Read & Write Operations [PYQ: 2015–2025]

A magnetic core memory array uses toroidal ferrite cores woven with four distinct wires:

  1. X-Drive Wire: Carries +1/2Im or -1/2Im.
  2. Y-Drive Wire: Carries +1/2Im or -1/2Im.
  3. Sense Wire: Threaded through all cores in a plane to detect voltage pulses during Read.
  4. Inhibit Wire: Threaded parallel to Y-wires to prevent writing 1 when writing 0.

2.1 Operational Cycles

  • Destructive Read: Apply -1/2Im to selected X and Y wires. Net field -Im flips core from 1 (+Br) to 0 (-Br), inducing a voltage pulse on the Sense wire.
  • Write / Restore Cycle: Apply +1/2Im to X and Y. To write 0, apply -1/2Im to the Inhibit wire to cancel net field to +1/2Im < Im.